Acronym | Name | Location | Submission Deadline | Start Date | Topics | Add to Watchlist |
|---|---|---|---|---|---|---|
| PAINE 2026 | IEEE International Conference on Physical Assurance and Inspection of Electronics | Phoenix, Arizona, United States | July 20, 2026 | October 27, 2026 | characterization and assurance advanced packaging and heterogeneous integration physical inspection image analysis and artificial intelligence |  |
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